Hongdian won the Best Landing Application Partner Award

On March 16, 2023, Qualcomm Connected Intelligent Edge Open Day co-organised by Qualcomm and Quectel was successfully held in Shenzhen. Experts from both companies gathered with operators and IoT industry partners to explore the changes and opportunities of IoT catalyzed by 5G and AI. As one of the key partners, Hongdian was invited to participate in this open day and won the Best Landing Application Partner Award.

Hongdian will continue to devote itself to the research and development of technologies in the IoT industry and other related fields, and promote the implementation of products and solutions through forward-looking research. With Qualcomm and Quectel, we will launch more wireless communication solutions in the near future and jointly promote the upgrading of the industry's digital intelligence.

Focusing on IoT market , helps customers improve the capability of decision-making and controlling

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